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4th World Congress on Materials Science & Engineering
13 August 2018 - 15 August 2018
In keeping with the Scientific Future Mission to aid the creation and sharing of materials science knowledge and experience, we are proud to announce the World Congress and Expo on Materials Science & Polymer Engineering, taking place in August 13-15, 2018 at London, UK. Focusing on the high impact topics of Polymer Engineering, biomaterials, nanoscience and technology, materials for energy and advanced materials and processing, the conference will bring together hundreds of leading researchers to share and discuss cutting edge research and engage in high level debate. Participants will include prominent researchers from academia and industry, and the meeting will provide a rare networking opportunity to meet leaders and peers working on solutions to some of the key issues facing materials scientists today.
The aim of the conference is to facilitate interactions within the research community and discuss the latest developments in this rapidly advancing field. The meeting responds to the demand for high quality products for both industry and consumers, which has led to rapid developments in materials science and engineering. It also provides the premier interdisciplinary and multidisciplinary forum for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns, practical challenges encountered and the solutions adopted in the field of Materials Science and polymer Engineering. It also offers a tremendous opportunity for researchers; practitioners and industrial scientists to represent a diverse multi-disciplinary range of sciences to meet and discuss the cutting edge topics in nanotechnology and materials science.
The conference will feature the latest research on cutting edge materials science topics, covering four focus sessions. Topics will include, Materials Science, Nanoscience and technology, Materials for energy, polymer Engineering and advanced materials and processing.